Abstract--Despite significant advancements in deep classification techniques and in-lab automatic optical inspection (AOI) models for long-tailed or highly imbalanced data, applying these approaches to real-world IC defect classification tasks remains challenging. This difficulty stems from two primary factors. First, real-world conditions, such as the high yield-rate requirements in the IC industry, result in data distributions that are far more skewed than those found in general public imbalanced datasets. Consequently, classifiers designed for open imbalanced datasets often fail to perform effectively in real-world scenarios. Second, real-world samples exhibit a mix of class-specific attributes (e.g., defect types) and class-agnostic, domain-related features (e.g., design characteristics of product lines). This complexity adds significant difficulty to the classification process, particularly for highly imbalanced datasets. T o address these challenges, this paper introduces the IC-Defect-14 dataset, a large, highly imbalanced IC defect image dataset sourced from AOI systems deployed in real-world IC production lines. This dataset is characterized by its unique "intra-class clusters" property, which presents two major challenges: large intra-class diversity and high inter-class similarity. These characteristics, rarely found simultaneously in existing public datasets, significantly degrade the performance of current state-of-the-art classifiers for highly imbalanced data. T o tackle this challenge, we propose the Regional Channel Attention-based Multi-Expert Network (ReCAME-Net). This network follows a multi-expert classifier framework and integrates a regional channel attention module, metric learning losses, a hard category mining strategy, and a knowledge distillation procedure. Extensive experimental evaluations demonstrate that ReCAME-Net outperforms previous state-of-the-art models on the IC-Defect-14 dataset while maintaining comparable performance and competitiveness on general public datasets. Our resources can be found at https://github.com/Y

Defective surgical instruments pose serious risks to sterility, mechanical integrity, and patient safety, increasing the likelihood of surgical complications. However, quality control in surgical instrument manufacturing often relies on manual inspection, which is prone to human error and inconsistency. This study introduces SurgScan, an AI-powered defect detection framework for surgical instruments. Using YOLOv8, SurgScan classifies defects in real-time, ensuring high accuracy and industrial scalability. The model is trained on a high-resolution dataset of 102,876 images, covering 11 instrument types and five major defect categories. Extensive evaluation against state-of-the-art CNN architectures confirms that SurgScan achieves the highest accuracy (99.3%) with real-time inference speeds of 4.2-5.8 ms per image, making it suitable for industrial deployment. Statistical analysis demonstrates that contrast-enhanced preprocessing significantly improves defect detection, addressing key limitations in visual inspection. SurgScan provides a scalable, cost-effective AI solution for automated quality control, reducing reliance on manual inspection while ensuring compliance with ISO 13485 and FDA standards, paving the way for enhanced defect detection in medical manufacturing.

In the semiconductor sector, due to high demand but also strong and increasing competition, time to market and quality are key factors in securing significant market share in various application areas. Thanks to the success of deep learning methods in recent years in the computer vision domain, Industry 4.0 and 5.0 applications, such as defect classification, have achieved remarkable success. In particular, Domain Adaptation (DA) has proven highly effective since it focuses on using the knowledge learned on a (source) domain to adapt and perform effectively on a different but related (target) domain. By improving robustness and scalability, DA minimizes the need for extensive manual re-labeling or re-training of models. This not only reduces computational and resource costs but also allows human experts to focus on high-value tasks. Therefore, we tested the efficacy of DA techniques in semi-supervised and unsupervised settings within the context of the semiconductor field. Moreover, we propose the DBACS approach, a CycleGAN-inspired model enhanced with additional loss terms to improve performance. All the approaches are studied and validated on real-world Electron Microscope images considering the unsupervised and semi-supervised settings, proving the usefulness of our method in advancing DA techniques for the semiconductor field.

In the field of integrated circuit manufacturing, the detection and classification of nanoscale wafer defects are critical for subsequent root cause analysis and yield enhancement. The complex background patterns observed in scanning electron microscope (SEM) images and the diverse textures of the defects pose significant challenges. Traditional methods usually suffer from insufficient data, labels, and poor transferability. In this paper, we propose a novel few-shot learning approach, SEM-CLIP, for accurate defect classification and segmentation. SEM-CLIP customizes the Contrastive Language-Image Pretraining (CLIP) model to better focus on defect areas and minimize background distractions, thereby enhancing segmentation accuracy. We employ text prompts enriched with domain knowledge as prior information to assist in precise analysis. Additionally, our approach incorporates feature engineering with textual guidance to categorize defects more effectively. SEM-CLIP requires little annotated data, substantially reducing labor demands in the semiconductor industry. Extensive experimental validation demonstrates that our model achieves impressive classification and segmentation results under few-shot learning scenarios.

In this work we investigate the ability of large language models to predict additive manufacturing defect regimes given a set of process parameter inputs. For this task we utilize a process parameter defect dataset to fine-tune a collection of models, titled AdditiveLLM, for the purpose of predicting potential defect regimes including Keyholing, Lack of Fusion, and Balling. We compare different methods of input formatting in order to gauge the model's performance to correctly predict defect regimes on our sparse Baseline dataset and our natural language Prompt dataset. The model displays robust predictive capability, achieving an accuracy of 93\% when asked to provide the defect regimes associated with a set of process parameters. The incorporation of natural language input further simplifies the task of process parameters selection, enabling users to identify optimal settings specific to their build.

Few-shot defect multi-classification (FSDMC) is an emerging trend in quality control within industrial manufacturing. However, current FSDMC research often lacks generalizability due to its focus on specific datasets. Additionally, defect classification heavily relies on contextual information within images, and existing methods fall short of effectively extracting this information. To address these challenges, we propose a general FSDMC framework called MVREC, which offers two primary advantages: (1) MVREC extracts general features for defect instances by incorporating the pre-trained AlphaCLIP model. (2) It utilizes a region-context framework to enhance defect features by leveraging mask region input and multi-view context augmentation. Furthermore, Few-shot Zip-Adapter(-F) classifiers within the model are introduced to cache the visual features of the support set and perform few-shot classification. We also introduce MVTec-FS, a new FSDMC benchmark based on MVTec AD, which includes 1228 defect images with instance-level mask annotations and 46 defect types. Extensive experiments conducted on MVTec-FS and four additional datasets demonstrate its effectiveness in general defect classification and its ability to incorporate contextual information to improve classification performance. Code: https://github.com/ShuaiLYU/MVREC

Ensuring the quality and reliability of Metal Additive Manufacturing (MAM) components is crucial, especially in the Laser Powder Bed Fusion (L-PBF) process, where melt pool defects such as keyhole, balling, and lack of fusion can significantly compromise structural integrity. This study presents SL-RF+ (Sequentially Learned Random Forest with Enhanced Sampling), a novel Sequential Learning (SL) framework for melt pool defect classification designed to maximize data efficiency and model accuracy in data-scarce environments. SL-RF+ utilizes RF classifier combined with Least Confidence Sampling (LCS) and Sobol sequence-based synthetic sampling to iteratively select the most informative samples to learn from, thereby refining the model's decision boundaries with minimal labeled data. Results show that SL-RF+ outperformed traditional machine learning models across key performance metrics, including accuracy, precision, recall, and F1 score, demonstrating significant robustness in identifying melt pool defects with limited data. This framework efficiently captures complex defect patterns by focusing on high-uncertainty regions in the process parameter space, ultimately achieving superior classification performance without the need for extensive labeled datasets. While this study utilizes pre-existing experimental data, SL-RF+ shows strong potential for real-world applications in pure sequential learning settings, where data is acquired and labeled incrementally, mitigating the high costs and time constraints of sample acquisition.

This study addresses the classification of defects in apples as a crucial measure to mitigate economic losses and optimize the food supply chain. An innovative approach is employed that integrates images from the visible spectrum and 660 nm spectral wavelength to enhance accuracy and efficiency in defect classification. The methodology is based on the use of Single-Input and Multi-Inputs convolutional neural networks (CNNs) to validate the proposed strategies. Steps include image acquisition and preprocessing, classification model training, and performance evaluation. Results demonstrate that defect classification using the 660 nm spectral wavelength reveals details not visible in the entire visible spectrum. It is seen that the use of the appropriate spectral range in the classification process is slightly superior to the entire visible spectrum. The MobileNetV1 model achieves an accuracy of 98.80\% on the validation dataset versus the 98.26\% achieved using the entire visible spectrum. Conclusions highlight the potential to enhance the method by capturing images with specific spectral ranges using filters, enabling more effective network training for classification task. These improvements could further enhance the system's capability to identify and classify defects in apples.

Traditional defect classification approaches are facing with two barriers. (1) Insufficient training data and unstable data quality. Collecting sufficient defective sample is expensive and time-costing, consequently leading to dataset variance. It introduces the difficulty on recognition and learning. (2) Over-dependence on visual modality. When the image pattern and texture is monotonic for all defect classes in a given dataset, the performance of conventional AOI system cannot be guaranteed. In scenarios where image quality is compromised due to mechanical failures or when defect information is inherently difficult to discern, the performance of deep models cannot be guaranteed. A main question is, "how to solve those two problems when they occur at the same time?" The feasible strategy is to explore another feature within dataset and combine an eminent vision-language model (VLM) and Large-Language model (LLM) with their astonishing zero-shot capability. In this work, we propose the special ASE dataset, including rich data description recorded on image, for defect classification, but the defect feature is uneasy to learn directly. Secondly, We present the prompting for VLM-LLM against defect classification with the proposed ASE dataset to activate extra-modality feature from images to enhance performance. Then, We design the novel progressive feature alignment (PFA) block to refine image-text feature to alleviate the difficulty of alignment under few-shot scenario. Finally, the proposed Cross-modality attention fusion (CMAF) module can effectively fuse different modality feature. Experiment results have demonstrated our method's effectiveness over several defect classification methods for the ASE dataset.

This survey paper offers a comprehensive review of methodologies utilizing machine learning (ML) classification techniques for identifying wafer defects in semiconductor manufacturing. Despite the growing body of research demonstrating the effectiveness of ML in wafer defect identification, there is a noticeable absence of comprehensive reviews on this subject. This survey attempts to fill this void by amalgamating available literature and providing an in-depth analysis of the advantages, limitations, and potential applications of various ML classification algorithms in the realm of wafer defect detection. An innovative taxonomy of methodologies that we present provides a detailed classification of algorithms into more refined categories and techniques. This taxonomy follows a three-tier structure, starting from broad methodology categories and ending with specific techniques. It aids researchers in comprehending the complex relationships between different algorithms and their techniques. We employ a rigorous empirical and experimental evaluation to rank these varying techniques. For the empirical evaluation, we assess techniques based on a set of five criteria. The experimental evaluation ranks the algorithms employing the same techniques, sub-categories, and categories. Also the paper illuminates the future prospects of ML classification techniques for wafer defect identification, underscoring potential advancements and opportunities for further research in this field